Process Flow
Loading Material----Feeding Material----Take Materials to the Workbench----Visual Inspection of the Crystal Position in Crystal Disc----Take the Crystal----Visual Inspection of LED Die Bond Position----Adhesive Die Attach----Die Bond----Unloading
Control System Requirements
Main Features
● Adopt Googoltech's GTS-PG controller, the core consists of DSP and FPGA to achieve high-performance control calculation.
● High-speed and high-precision point motion and interpolation control;
● Convenient for IO expansion and maintenance;
● The die bond cycle is up to tens of milliseconds.
System Advantage
After field testing, the die bonder control system solution has stable performance, low vibration, high speed and high precision, which can fully meet the customer's on-site operation requirements. Currently, the solution is already in use and performance is recognized by customers.
